Good Morning Henry, To answer your question, yes I have experienced non-wetting with Pd along with Sn85Pb15 & Sn80Pb20 lead finishes. The first question is, "where does the non-wetting occur?" Typically solder plated or solder dipped leads during reflow experience mixing of the solder screened onto the substrate and the lead itself providing a smooth transition from the solder to the lead. With alternate lead finishes such as Pd, the only solder available to form the joint is that which is applied via printing, dispensing or wire core. This provides little or no solder on the top of the foot creating a transition line along the lead outline. The second question is, "does your solder joint exhibit good wetting at the heel and the along the foot?" The most casual observer will say the solder joint is a defect but under heightened magnification and scrutiny, the joint is probably acceptable but looks different. TI used to have a user's manual on Pd lead finish available for download. I suggest that you get a copy of that document and also begin a training exercise for your operators and inspectors regarding the differences in solder joint wetting characteristics dependent on lead finish. Steve Sauer Mfg Engineer Northrop Grumman, Xetron --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------