Hello Technet: I'm not sure if this was distributed to technet or not, (it got bounced back) I'm sending it again... We're starting to design a 6 layer SMT board, which is 1" x 2". The assembly will include flip-chips on both sides (maybe 10 total), along with a number of resistors and caps. The board will most likely include blind and buried vias. The material might be FR-4, or maybe polyimide. The pallet will probably be combined routing and scoring. (I'm trying to guess what other information might be needed.) Anyway, my question is how far from the edges do I need to keep the component? Flip-chip? Chips? Thanks, Jim Marsico Senior Engineer Production Engineering EDO Electronics Systems Group [log in to unmask] <mailto:[log in to unmask]> 631-595-5879 --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------