Hello,
I have a customer
using a 95Pb/5Sn/2.5ag composition solder paste in a high temp copper lead frame
application. The RMA flux is being cleaned but white residue around the solder
points is noticed after the multiple rinse stages and dry (ultrasonic batch
process).
Suspicion of having
the rinse water too hot combined with the effects of high purity DI water
causing corrosion to the lead solder. Should the dryer be inerted?
Am I off base here?
Looking for advice
from others using this type of solder formula .
Thanks
Charlie Pitarys
Director of Application
Technologies
603.622.2900 X-115
www.kyzen.com