First of all I think to really understand the class 3 PCB criteria one must look at IPC-6012.  As far as the 610 criteria look at 6.5.2 which will indicate this as a process indicator unless 5.4.1 or 10.7 is violated.  5.4.1 doesn't apply to this issue but 10.7 would if the traces have had a height reduction.  These criteria come from the IPC-6012.  Also look at 6.5.1 for the rerun.  This is allowed for rerunning but you must have a high degree of assurance that the thermal cycle won't damage the parts.  I have had to do this rerun before and with standard parts solder spec'ed to Mil-202  haven't seen a problem.  But none of those were class 3 but class 2. 

 

 

Kathy

02 06:10AM >>>
I agree with you, as far as trimming leads before soldering. I agree, a
solder - cut - solder process should be avoided if possible.

But, I can't find any place in the J-STD-001C or IPC-A-610C which bans
exposed copper. In fact, I can only find places where it is specifically
acceptable, even including nicked leads unless the damage is greater than
10% of the lead diameter or thickness. Unless the damage is the result of
careless or repeated bending.

Is this a topic worthy of discussion? Have I misinterpreted the standards?