Voiding within specified limits is not a problem as often stated. However, as a process indicator, you must look at all elements contributing to solder joint formation and voiding therein. If "excessive" voiding is apparent or contines, what's contributing to it? Your profile looks typical for most solder paste brands/types but what else is there as oxidation or other contamination requiring the paste/flux to continue the struggle to clean the solder termination area? MoonMan --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------