Please describe the process steps you are currently using to build the boards. Russ >From: tony steinke <[log in to unmask]> >Reply-To: "TechNet E-Mail Forum." <[log in to unmask]>, tony steinke ><[log in to unmask]> >To: [log in to unmask] >Subject: [TN] conductive blind via plug >Date: Wed, 29 May 2002 09:33:28 -0700 > >Techies, >We have done some initial testing on the DuPont CB100 conductive via plug >with blind via application and so far have been unsuccessful. The blind via >is approximately .016 diameter and .030 in depth. The biggest problem we >are experiencing is getting adhesion(BGA pads popping off) with >copper plating after the CB100 has been applied. Is there >another type of conductive blind via plug recipe on the market. >Thanks for any comments >Tony Steinke _________________________________________________________________ Join the world’s largest e-mail service with MSN Hotmail. http://www.hotmail.com --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------