I am searching for any data out in the industry referencing the affects
of conformal coatings on BGA devices? How much coating should be allowed
under the device? Should the underside of the BGA be completely dammed or
underfilled? I have collected data that shows standard spraying of coating
material does not affect life cycle, but allowing complete underfill of the
coating material greatly reduces life cycle. What concerns are there for
leaving exposed adjacent uncoated conductors (BGA balls) under the BGA
devices?

Regards,

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------