I am searching for any data out in the industry referencing the affects of conformal coatings on BGA devices? How much coating should be allowed under the device? Should the underside of the BGA be completely dammed or underfilled? I have collected data that shows standard spraying of coating material does not affect life cycle, but allowing complete underfill of the coating material greatly reduces life cycle. What concerns are there for leaving exposed adjacent uncoated conductors (BGA balls) under the BGA devices? Regards, --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------