Steve:
It
sounds good in theory, but in practice there will be a difference. When
plugging vias with solder resist, it often took six or more (nine or twelve)
strokes to fill a via from one side on nominal .060 to .070 thick boards.
My read is that a second pass will result in an additional 5 to 10 mils of
fill.....definitely not enough additional metal to make a
difference.
Look
at it this way......the pads with a via make for easy rework......just
touch the lead and it's ready for a jumper.
Don
Vischulis
Hi Mark,
I hope
you've seen my pictures and seen what happened with me. But something you might
try that I didn't think of when I ran my ten boards, is to do a double print
stroke when printing the board...this may "force" some of the paste down inside
the via and give it a bit of additional paste to fill down inside the via so
that it doesn't suck so much from the fillet... maybe worth a try.
-Steve
Gregory-
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