Good Morning TechNetters, thank you for the helpful and informative replies, especially to Graham Naisbitt and Michael Simms for giving directions. Volkmar _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ DRÄGER ELECTRONICS Draeger Electronics GmbH Moislinger Allee 53-55 D-23558 Lübeck Tel: +49-451-882-3998 Fax: +49-451-882-4365 mailto:[log in to unmask] Website http://www.draeger.com/de/EL _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Volkmar Huss wrote: > Hi TechNetters, > > we are working on defining our "No Clean" soldering process. The > solder-paste and flux manufacturers certify the "No Clean" capability of > > their products to some extend, but what is the definition of "No Clean"? > > And I don't mean the statement, that only inert residues of flux and > solder-paste additives remain on the board. > Are there any standards that can used as a reference? > How do you measure the: > "No Clean" capability of solder paste, flux and tubular solder with flux > > core? > "No Clean" quality of printed board assemblies? > "No Clean" quality of printed board assemblies onto which devices have > been hand-soldered? > and all of this for prototype and series production? > > I have gleaned some insights from the TechNet archives, but any > additional input is very welcome. > >