I have two main questions to ask : Q1 : Single-sided board reliability. - in the usual fabrication process, single sided board only have pads on one side and the holes are not plated-through. What is the chances that the component will fly off or pads lifted during vibration test? - if everything remain but the hole wall is plated, will the solder joint now be more robust to withstand vibration or the component will stay put or pads will not be lifted? Q2 : warpage - I noticed that warpage indicated in the IPC standard usually are confined to boards that are 4 sided. For my board, flatness is a must but the board is of odd shape or irregular shape. How do I perform the warp test and acceptance? Regards - Wee Mei --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------