Gary- great idea,  IPC needed to expand it list of component land patterns.
            Having choices between HDI footprints and relaxed (typical) designs is something
            most of us designers have to constantly do on our own.  I work in an environment
            where 40% of my designs require changes to footprint designs (Both IPC and Supplier)
            to accommodate for lack of real-estate.             Missing  footprint option in new IPC-7351 format.
            Descretes need a design showing VIP (via in pad) configuration.  Most people trying this in design would agree
            via should be located off center from the pad.  For power inductance reasons we place them on the
            inside edge of pads.  So vias are as close to each other as practical.  I know this could be a reach for IPC
            to join in on this concept, but it is here to stay.  HDI design require this concept to work.             Since the council has both fabrication and assembly members they should show how they prefer
            VIP technology.
  Greg Scott
Cray Inc.