Sigi, Before redesigning the whole board, which is really the proper cure to this problem you can try the following. Vias on the bottom( opposite) side should have the solder mask almost closing the hole: : Drill + 4 mils - provided they are not used for Ict. This will eliminate some of the paste loss. Then add extra solder past to the troublesome locations either by enlarging the stencil opening (opening may be larger then the pad size) or by injecting paste in rework station or even in line if your line is so configured. Mickey >>> [log in to unmask] 15-Apr-02 6:08:35 PM >>> Hello to all We have to redesign different board's because of Via in Pad: Situation now: FR4, thickness 1,5 mm, OCC finish Through Hole Vias in Pads (middle, diameter 0,15..0,3 mm) The problem is the sucking of solder form to the top to the bottom side (causing low solder on top and bumps on test points on the bottom side) Because of place limitations dog bones can't probably not be used. What is your recommendation? Using Blind Vias (problem of Voids in the solder joint?) ? Epoxy (with Ag or what else) filled Vias? Vias on the edge of the pad? More ideas? All input is welcome Best regards Siggi ---------------------------------------------------------------------------- - Kind regards / Mit freundlichen Gr??en Dr. Siegmund Zweigart --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 --------------------------------------------------------------------------------- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------