Ahhh vias in pads...what timing. In fact built a board last week that I had no idea
that they put vias in the pads until the bare fab showed up. Soon as I seen it I was
screaming like a banshee!!
Them: What's wrong Steve? Why are you so wound-up?
Me: Because there's vias in the pads!!
Them: Is that really a problem? Won't the solder just fill them up?
Me: Yes it will...and take all the solder away from the fillet to do it...
Them: Oh it can't be that bad, the via is so small...
Me: Okay, trust me on this...you'll see.
Go to: http://www.stevezeva.homestead.com and tell me I was right.
Luckily, this is just a pre-production build of 10 boards...I think there is going to be a redesign after this...hehehe
-Steve Gregory-
This problem is never ending. I'm working now on the ugliest R/F board
imagineable. It too has all your problems. However, I have a forward
thinking engineer who understands the issues involved as you state them. We
are redesigning and he's recalculating to eliminate those issues. So, it can
be done. No, unless you redesign, you have a lost cause notwighstanding
rework adn subsequentg chip cracking due to thermal issues related trying to
solder the little mutha's.
You can add vias in pads only as micro types or those having been plugged
and plated over. Still a redesign exists.
On the same note, can someone recommend a good R/F and other electrical
performance tool that is relatively easy to use? Hell of a question I know,
but consider the source.
MoonMan