I'm no expert on this or anything else for that matter, but I've changed all my 0603 pads to rather convential 0402 pads based on an "old" HP study. I like everything everyone has said. I even like round pads for chips so they "self" align and, for sure, BGA's for paste release characteristice but SMQ92J solved that problem - for me. I just don't want poor solder joints. Whatever happened to home plate pads? I use them for 0402's still. I don't use HASL on anything anymore so that problem is removed. Also, I try very hard to eliminate component solderability issues before they occur. Solderability testing, you know?. That one is difficult at times and don't even know if it's getting better. I do still xray from time to time even on chips and leaded devices. It provides some evidence about how well flux is doing its job relative to removing oxidation. If it doesn't work well, or if oxidation is excessive, it can't do its job so voiding is apparent. Having said that, an old can of workms is opened but this stuff should be vanquished. MoonMan --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------