Technetters, To a certain extent I am aware of the work the NEMI tin whisker task force and various connector/component manufacturers are doing about 100% tin coatings. But I am still left with several questions whose answers I have missed or questions that have not been addressed. So... here goes - the immersion tin coating are for SMT pads that are going to be soldered. What are people doing about test points? Are there stencil openings to put solder on these pads as well? Or are these pads left unsoldered? Has anyone carried out any testing with regards to the tendency of these materials to grow/not grow whiskers? Or do the organics in the coating completely kill that possibility? regards, Bev Christian Research in Motion --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------