All, I'm searching for an automated process (conveyorized) to attach heatsinks to an ASIC (BGAs or CCGAs) component prior to reflow soldering. The process I'm interested in would attach the heatsink directly to the 1/2" die. Currently we are using Chomerics adhesive tapes and/or 384 thermal conductive adhesive with 7387 activator. These solutions, for the most part, cannot be conveyorized. They are time consuming (Loctite is a 5 min. cure) or are a poor adhesive (Chomerics tapes have poor adhesion to a 1/2" glass die). The ideal process would be able to: 1. Place the ASIC components in wet solder paste. 2. Pick n place the heatsink on to the ASIC component. This may require some type of liquid adhesive to be dispensed or have an adhesive tape be preloaded on the heatsink. This is the $1,000,000 question: Is there an adhesive (liquid, tape or other)that will be compatible with this process? Some of the problems I foresee are: The adhesive (liquid or tape) generally require some pressure or force to make the heatsink adhere to the substrate. Little or no force can be exerted by the heatsink otherwise the solder paste will short underneath BGAs or CCGAs. 3. Reflow the solder paste and cure the adhesive (liquid, tape or other) using a typical reflow profile. The process sounds relatively easy but after a detailed analysis it is quiet complex. Is there a solution? --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------