Good day, Technet: Years ago, if one wanted to keep abreast of the latest and greatest designs and assembly technologies for high reliability military applications, one would attend the yearly seminars at China Lake. What conferences would be recommended nowadays? Also, if I may be so bold as to address a previous topic (chuckle, chuckle), with regard to restraining core technology for military products, (Leadless ceramic components , conduction heat dissipation, etc.) it seems that the consensus for new designs would be to use a low TCE laminate (Thermount?) with a compliant bond to an aluminum core. For you military folks, agree or disagree? Jim Marsico Senior Engineer Production Engineering EDO Electronics Systems Group [log in to unmask] <mailto:[log in to unmask]> 631-595-5879 --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------