Peter That's exactly what I was getting at. Most of our applications for CB-100 are for filled vias that need to be plated over to provide a solderable surface and/or prevent solder from running out the bottom end of the via. > ---------- > From: [log in to unmask][SMTP:[log in to unmask]] > Reply To: TechNet E-Mail Forum.;[log in to unmask] > Sent: Monday, April 29, 2002 5:40 PM > To: [log in to unmask] > Subject: Re: [TN] Via Plug > > I just did a calculation for some of our boards that use this via plug > material for enhancing thermal transfer between chips and thermal planes. > The calculation was to see by how much I would have to increase hole > plating thickness by in order to completely replace the epoxy in terms of > thermal conductivity. > > I'm talking about a 24 mils diameter hole, plated initially to 1/2 oz > copper minimum and filled with epoxy. The board is 63 mils thick. Can you > guess what the increase is? ..... It's actually only 0.2 oz or 0.28 mils, > according to our thermal engineer. So why go to all the trouble and > expense > of filling holes if the only purpose is thermal - a fairly small increase > in plating thickness is all that's needed. > > Peter > > > > Earl Moon <[log in to unmask]> 30/04/2002 05:49 AM > Sent by: TechNet <[log in to unmask]> > > Please respond to "TechNet E-Mail Forum."; Please respond to Earl Moon > > To: [log in to unmask] > cc: (bcc: DUNCAN Peter/Asst Prin Engr/ST Aero/ST Group) > Subject: Re: [TN] Via Plug > > > > > > > > > Don't mean to but in, but what the hell. Just think how much surface > copper > would be plated and how much resist would have to be applied and how much > plating overhang would be involved even with several resist layers > applied, > etc.. > > MoonMan > > -------------------------------------------------------------------------- > ------- > > Technet Mail List provided as a free service by IPC using LISTSERV 1.8d > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt delivery of Technet send e-mail to [log in to unmask]: > SET Technet NOMAIL > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/html/forum.htm for additional > information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 > ext.5315 > -------------------------------------------------------------------------- > ------- > > > > > > [This e-mail is confidential and may also be privileged. If you are not > the > intended recipient, please delete it and notify us immediately; you should > not copy or use it for any purpose, nor disclose its contents to any other > person. Thank you.] > > -------------------------------------------------------------------------- > ------- > Technet Mail List provided as a free service by IPC using LISTSERV 1.8d > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt delivery of Technet send e-mail to [log in to unmask]: > SET Technet NOMAIL > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/html/forum.htm for additional > information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 > ext.5315 > -------------------------------------------------------------------------- > ------- > --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------