John, We've looked into the sand thing a while ago, and found that just by increasing the copper plating in the hole to 2 mils will give you far better thermal performance than any thermally conductive epoxy for hole fill. Jim Marsico Senior Engineer Production Engineering EDO Electronics Systems Group [log in to unmask] <mailto:[log in to unmask]> 631-595-5879 -----Original Message----- From: John Foster [SMTP:[log in to unmask]] Sent: Tuesday, April 23, 2002 3:07 PM To: [log in to unmask] Subject: [TN] Via Plug Hello, I am new to this listserver. I must say that it is very informative. I wish I had known of it long ago. I have a question about via plugging. Right now our board vendor is doing our via plugs with I guess with a standard epoxy. We are trying to find a solution that would give us a much better thermal performance. We are looking at silver epoxy and this material from Dupont. Does anyone know of some material that would give us a really good thermal performance. We are in a commercial environment. So the material does not have to meet industrial specs. Any input on this matter would be greatly ' appreciated. Thank You John Foster ---------------------------------------------------------------------------- ----- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------- ----- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------