We build mostly high end RF circuit boards and are faced with component land patterns that the IPC standards do not address. Our rule of thumb is the exact opposite of what I have seen most of you concur on, and that is, we use the manufacturers data sheet first, until we find that it does not work. Very rarely do we have to change the land patterns. And then it is primarily only when the circuit is not performing adequately. We also sell our chip set and therefore do a lot of work to prepare a documented and well proven package for the customers. There is a lot to be said for following the instructions that a supplier gives you when it comes to custom components such as BCCs and duplexors. I just don't want everyone to assume that the suppliers data sheets are always junk. But I do wish that the customers would provide feedback especially if they find a land pattern that works even better. --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------