Thanks for the feedback. The UL requirements might be something good to look at. What I thought might be a concern is if the die bond to the case could be damaged by the relatively high reflow temperature.
So far, I have only looked at datasheets from two component manufacturers, neither of them address the through hole components in reflow, so maybe they are missing the boat. I have read that through-hole reflow is the future of soldering in the electronics industry. If so, the component manufacturers must be there with the data to support this. Sure, most through hole parts that will be reflow soldered are connectors, but there may be some components where it makes sense to reflow instead of wave, selective, or hand solder. It certainly makes sense for us with only 1 or 2 through hole parts on a board.
Howard Watson
Manufacturing Engineer
AMETEK/Dixson
04/11/02 07:15 AM
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Subject: Re: [TN] Through hole components in Reflow
I would look at the plastic construction and maybe go through the UL file requirements for that plastic. They are probably the answer on what the flammability rating would be with data to support it. Maybe looking at the UL tests you could find reasoning that your customer would accept.
Interesting problem though. We don't currently have products were pin to paste is possible due to several factors so I have not had to look at components for this recommendation. Are component manufacturer's testing and making recommendations for pin to paste processes (other than this part) or has the industry missed the boat and this will become a larger issue as the technology grows?