Hi
Jim,
depends on what your
assemblies look like. With the usual stuff (Rīs and Cīs and smaller (lighter
parts)) on one side, usually called bottom side, itīs should really not be a
problem at all, just do the heavy stuff last.
As mentioned before look after possible
mechanical impact of the already populated side, especially during second
reflow.
If you go for glueing and wavesolder SMD the
same caution should be taken.
If the latter is true for you it might take
a bit more effort to implement the process of glueing and handling your
workpieces, with doubleside reflow itīs not that much of a problem ... except
for your THT-parts.
Good luck
Wolfgang