Teckies, need a little help hear!

I have recently experienced a problem whilst cleaning double sided FR4
dual technology multi-layer boards that had been wave soldered.
The boards (4 off) were put into a fully automatic batch cleaner end of
day shift which uses a Brominated solvent 'ENSOLV ionic' .and removed
the following morning first thing.
The cleaning m/c is a vapour degrease system which has a refrigerated
coil at the top of the bath, this provides a free board zone above the
vapour which forms part of the cycle (draining).  =20
The cycle time is usually 30 minutes.

The problem is that the boards appear to show weave / pre-preg
separation across all of the boards leaving the weave visible but not
through to the top layer.  Around thru' hole terminations the board has
clearly delaminated.

I performed 100% inspection on another one of the wave soldered batch
which appeared fine.  I repeated the cleaning exercise and the post
cleaning result was the same.  =20

Two things to note, firstly, when the board was removed after the
second=

cleaning operation the m/c had malfunctioned as the cooling coil had
not=

worked so the free board zone was hot with vapour.  What I cannot
guarantee is that this did not happen during the first cleaning
operation (4 off), I can't say I noticed the boards being hot but I
suppose the m/c could possibly have malfunctioned part of the time.
Secondly, these boards have been cleaned previously in the m/c but
during a shift and removed after the cycle.

Has anyone experienced this type of occurrence?

CIA,
      Iain.




********************************************************************
This email and any attachments are confidential to the intended
recipient and may also be privileged. If you are not the intended
recipient please delete it from your system and notify the sender.
You should not copy it or use it for any purpose nor disclose or
distribute its contents to any other person.
********************************************************************

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to <a href="/scripts/wa.exe?LOGON=A3%3Dind0203%26L%3DTECHNET%26E%3Dquoted-printable%26P%3D2606610%26B%3D--%26T%3Dtext%252Fplain%3B%2520charset%3DISO-8859-1%3B%2520name%3D%2522BDY.RTF%2522%26N%3DBDY.RTF" target="_parent" >[log in to unmask]</a> with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send e-mail to <a href="/scripts/wa.exe?LOGON=A3%3Dind0203%26L%3DTECHNET%26E%3Dquoted-printable%26P%3D2606610%26B%3D--%26T%3Dtext%252Fplain%3B%2520charset%3DISO-8859-1%3B%2520name%3D%2522BDY.RTF%2522%26N%3DBDY.RTF" target="_parent" >[log in to unmask]</a>: SET Technet NOMAIL
To receive ONE mailing per day of all the posts: send e-mail to <a href="/scripts/wa.exe?LOGON=A3%3Dind0203%26L%3DTECHNET%26E%3Dquoted-printable%26P%3D2606610%26B%3D--%26T%3Dtext%252Fplain%3B%2520charset%3DISO-8859-1%3B%2520name%3D%2522BDY.RTF%2522%26N%3DBDY.RTF" target="_parent" >[log in to unmask]</a>: SET Technet Digest
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at <a href="/scripts/wa.exe?LOGON=A3%3Dind0203%26L%3DTECHNET%26E%3Dquoted-printable%26P%3D2606610%26B%3D--%26T%3Dtext%252Fplain%3B%2520charset%3DISO-8859-1%3B%2520name%3D%2522BDY.RTF%2522%26N%3DBDY.RTF" target="_parent" >[log in to unmask]</a> or 847-509-9700 ext.5315
---------------------------------------------------------------------------------