Bruno As they say in the country where I used to live, "Groezi wohl" to kalt Hamburg. Yes, I agree that outside consultancy can help and probably be cheaper in the long run, provided that Volkmar has researched the problem sufficiently to be able to define the terms of reference. If he leaves this open-ended, then it will cost zillions and may not get optimum results. My experience as a consultant is that most clients approach me saying that they want to change from x cleaning method to y cleaning method or z not to clean at all, without having a clue what is involved. It typically doubles the cost of the consultancy if they have not previously defined at least a baseline, because the act of definition gives them a much clearer mind and how to go about it. Another stumbling block is that, prior to visiting the site, I'm sometimes misinformed as to things like available equipment, end use conditions etc. which means that my preparation is often of limited use (I minimalise preparation, now, for that reason). Greetings from a cold and sunny Washington DC (back to the warmth of Cyprus by Friday!). Brian Volkmar Huss wrote: > > Hi TechNetters, > > we are working on defining our "No Clean" soldering process. The > solder-paste and flux manufacturers certify the "No Clean" capability of > > their products to some extend, but what is the definition of "No Clean"? > > And I don't mean the statement, that only inert residues of flux and > solder-paste additives remain on the board. > Are there any standards that can used as a reference? > How do you measure the: > "No Clean" capability of solder paste, flux and tubular solder with flux > > core? > "No Clean" quality of printed board assemblies? > "No Clean" quality of printed board assemblies onto which devices have > been hand-soldered? > and all of this for prototype and series production? > > I have gleaned some insights from the TechNet archives, but any > additional input is very welcome. > > Best regards > > Volkmar Hu > > Engineering Electronic Circuit Boards > Aufbau- und Verbindungstechnik > _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ > > DRGER ELECTRONICS > > Draeger Electronics GmbH > Moislinger Allee 53-55 > D-23558 Lbeck > > Tel: +49-451-882-3998 > Fax: +49-451-882-4365 > mailto:[log in to unmask] > Website http://www.draeger.com/de/EL > _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ > > -- > Best regards / Mit freundlichen Gren > > Volkmar Hu > > Engineering Electronic Circuit Boards > Aufbau- und Verbindungstechnik > _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ > > DRGER ELECTRONICS > > Draeger Electronics GmbH > Moislinger Allee 53-55 > D-23558 Lbeck > > Tel: +49-451-882-3998 > Fax: +49-451-882-4365 > mailto:[log in to unmask] > Website http://www.draeger.com/de/EL > _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ > > M!Lj)K iuZy y<+ x!$ u{.n+zwZ,j M! T9 _Yh)m {ax `ӓ rzWR cN Tr :-zjh(Z^+ޯ* M!lzw^ r HDygzN0 N qxD x)zZʇږ[az, צj)m ǫ*\ 4r 8 zRy܆*.,)౫p r :r^q j֛jǬ f > ܆+ް^jǯ ȭ y"m"+m_ߢٟv+bv wf '-)朅&jj+ljƤ*\(;O}M w15== --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------