Volkmar Manufacturers of fluxes produce and sell a wide range of fluxes which are sold as "no-clean". Some contain rosin, others don't. Some contain halogenated activators, others don't. Some are very active and are consequently easy to solder with, but leave more dangerous residues, others don't, but are the devil to solder with. Some you can clean, others you cannot. To answer your questions: you have to select a shortlist of, say, 5 fluxes which meet your criteria, on paper. You then do extensive trials, with various parameters (Taguchi is very useful for this, as you can cut the number of experiments drastically). After having optimised the process for each flux, you have to produce some test boards that you need to qualify as meeting your requirements for reliability under the conditions the boards will be used in (electrochemical migration etc.) and for setting up your process for quality control. As a result of this, you can select your #1 candidate and #2 to fall back on if there is an interruption of supply. No one here can do your homework for you, I'm afraid. Brian Volkmar Huss wrote: > > Hi TechNetters, > > we are working on defining our "No Clean" soldering process. The > solder-paste and flux manufacturers certify the "No Clean" capability of > > their products to some extend, but what is the definition of "No Clean"? > > And I don't mean the statement, that only inert residues of flux and > solder-paste additives remain on the board. > Are there any standards that can used as a reference? > How do you measure the: > "No Clean" capability of solder paste, flux and tubular solder with flux > > core? > "No Clean" quality of printed board assemblies? > "No Clean" quality of printed board assemblies onto which devices have > been hand-soldered? > and all of this for prototype and series production? > > I have gleaned some insights from the TechNet archives, but any > additional input is very welcome. > > Best regards > > Volkmar Hu > > Engineering Electronic Circuit Boards > Aufbau- und Verbindungstechnik > _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ > > DRGER ELECTRONICS > > Draeger Electronics GmbH > Moislinger Allee 53-55 > D-23558 Lbeck > > Tel: +49-451-882-3998 > Fax: +49-451-882-4365 > mailto:[log in to unmask] > Website http://www.draeger.com/de/EL > _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ > > -- > Best regards / Mit freundlichen Gren > > Volkmar Hu > > Engineering Electronic Circuit Boards > Aufbau- und Verbindungstechnik > _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ > > DRGER ELECTRONICS > > Draeger Electronics GmbH > Moislinger Allee 53-55 > D-23558 Lbeck > > Tel: +49-451-882-3998 > Fax: +49-451-882-4365 > mailto:[log in to unmask] > Website http://www.draeger.com/de/EL > _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ > > M!Lj)K iuZy y<+ x!$ u{.n+zwZ,j M! T9 _Yh)m {ax `ӓ rzWR cN Tr :-zjh(Z^+ޯ* M!lzw^ r HDygzN0 N qxD x)zZʇږ[az, צj)m ǫ*\ 4r 8 zRy܆*.,)౫p r :r^q j֛jǬ f > ܆+ް^jǯ ȭ y"m"+m_ߢٟv+bv wf '-)朅&jj+ljƤ*\(;O}M w15== --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------