Siggi, I know that TI generated a BGA Solderability Test method, based on the technique described in EIA/JESD22-B102C, Solderability Test Method. They used a reflow soldering oven to perform the test and a blank ceramic card. You can get a description of the test method from TI's website. I tried it with a SMT rework station, using a glass slide. I found that you could achieve the same type of results with the rework station as with the reflow oven and ceramic card. Give me a call off line some time. Hope this helps. Good Luck. Lee Whiteman Senior Manufacturing Engineer E-Mail: [log in to unmask] <mailto:[log in to unmask]> Ph: (610) 362-1200 x208 Fax: (610) 362-1290 > -----Original Message----- > From: TechNet [mailto:[log in to unmask]]On Behalf Of Zweigart, Siegmund > Sent: Thursday, March 14, 2002 4:03 AM > To: [log in to unmask] > Subject: [TN] Solderability of BGA > > > Hello > > I am looking for some documents about solderability tests for BGA s with > eutectik balls. Can anybody help me in this subject? > We think that the BGA- Balls were touched by fingers and the > solderiability > is significant reduced. > How can we analyse the component for fingerprints? We are thinking of > looking for NaCl. > Has anybody another idea? > > Siggi > > ------------------------------------------------------------------ > --------------- > Technet Mail List provided as a free service by IPC using LISTSERV 1.8d > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search previous postings at: www.ipc.org > On-Line Resources & > Databases > E-mail Archives > Please visit IPC web site http://www.ipc.org/html/forum.htm for additional > information, or contact Keach Sasamori at [log in to unmask] or > 847-509-9700 ext.5315 > ------------------------------------------------------------------ > --------------- > --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------