Mark, The National Physical Laboratory here in the UK did a studio project on just this very topic. I believe you can download their recommendations at www.npl.co.uk/ei Phil Kinner Chief Chemist Concoat Ltd 2C Albany Park, Frimley Road, Camberley, Surrey, GU16 7PH Tel: +44 (0) 1276 691100 Fax: +44 (0) 1276 691227 -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Mark Ross Sent: 18 March 2002 16:16 To: [log in to unmask] Subject: [TN] Books/articles on thermal profiling Can anyone recommend a book or technical articles on thermal profiling of assemblies in reflow ovens? There seems to be a difference of opinion on the correct way to do it. I have heard: "Use high temperature solder and solder the thermocouple to the part (great if it isn't a 0402 or worse an 0201!)" "Don't use high temperature solder, it will alter the thermal mass of the device. Use a high temperature epoxy that is thermally conductive and glue the probe to the device". "Don't use epoxy, it changes the thermal mass of the device, use a temperature thin metal tape that has a strong high temperature adhesive". Also when it comes to keeping the parts on the board, I was all for a board being conformal coated to keep the parts from moving, scraping back of the coating where I needed to take my readings and then run the board through. I have been told that conformal alters the thermal mass of the product. And on and on.... Last time I asked for suggestions on soldering books, I was pointed to one By Jennie Hwang and that worked out great so I am hoping there are some books or articles and maybe even an IPC spec on how to do this so that I can ensure we are profiling the boards correctly. Thanks for all input. _________________________________________________________________ MSN Photos is the easiest way to share and print your photos: http://photos.msn.com/support/worldwide.aspx ------------------------------------------------------------------------ --------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ------------------------------------------------------------------------ --------- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------