I have a customer who is requiring that I verify the bond strength of a heat sink that is glued to the top of PBGA. The customer has supplied me with a torque tool to verify the strength of the bond between the heat sink and the BGA. I have concerns that testing the strength of the glue bond may affect the solder joint reliability of the BGA. The tool supplied by the customer is set at 20 in pound torque. Any ideas how I can "change" my customer mind? --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------