Guys, On our nickel gold board, solder joints are below IPC spec (insufficient solder) where there are vias in pad. Solder is drained down the via holes and deprived the joint of necessary solder. I would like to know the following. (1) How about using the surface finish 63/37 coating HASL instead of Ni-Gold? I think gold dissolves in solder so quickly that I rather use HASL processed boards, any thoughts? (2) Do you guys mask the via on bottom side to avoid solder draining out on the other side? (3) Does anybody try Hi Temp solder paste to fill the vias as our assembly house ordered via stencils to fill the via using eutectic (63/37) solder paste which didn't work? Looking for re, Ken Patel --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------