Hello all, Well, as you can see I am catching up on emails today. One or two comments on this mailing. I have been Laser MicroViaing (new term?) fail-safe reliable PWBs for well over 5 years. And yes it was tough to get approvals relative to "Plated Through Holes" it came down to a lot of testing. At my previous employee we made two rules: no BGAs and no MicroVias. The day after that we had no choice and we were in the BGA with microvia product deliver service. Hence, yes MicroVias; like BGAs are in the military product and will be in future. On the through hole via and solder mask: the best tented via is the one that isn't. Encroachment of solder mask onto pad is best (leaving the via empty). If the need to "tent" is required (I hate that word tent) than I like the epoxy via fill and then subsequent mask. It is more expensive but product appropriate. This is relative to Military and Space Product, Commercial Applications do have more choices. Product Appropriate Design is Everything. Boston Brad 781 858 0783