Hi Dave!

You're thinking of SolderQuik BGA preforms...go to:

http://www.winslowautomation.com/bga.htm

The water soluble paper used in the preforms is a proprietary paper developed by Raychem that Winslow Automation bought the rights to...

-Steve Gregory-


Hi TechNet Land! I have had one too many Diet Cokes today and thus my
brains have quit functioning (both braincells at once) - therefore I pose
the following question to ya'all:

I distinctly remember a company called "Raychem" which used to sell a
solderball area "preform" which you could use to re-bump a BGA component
after you removed it off an assembly. The "preform" used a water soluble
material which could be removed in a water cleaning system after reflowing
the solderspheres onto the BGA. I went looking on the web and can't find a
"Raychem preform" group (I found lots of Raychem but not the one I
remember). Have I had too much Diet Coke? Does anyone remember these guys?
Or have they closed up shop?

As always, thank in advance!

Dave Hillman
Rockwell Collins
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