Seth, There are two basic ways to do it. One is, when necessary, to use sequential lamination that forces resin up the "standard" size (not micro via) hole leaving it relatively flat or flush to the surface. Then, the hole is electrolessly deposited and electroplated over. The second is to fill the holes with conductive material/resin and do the same. The conductive resin usually is silver and does a nice job as well. Flatness, to some, can be an issue. I'll post an image, showing a typical condition, on Steve's site if he will be so kind. However, the surfaces are suitable for BGA type devices because of their self aligning tendencies. Haven't used it for others but chip components that don't find the surfaces a problem especially compared to vias that are disastrous. This whole issue, for me, revolves around some R/F folks, and their designs, not recalculating the electrical requirements to get rid of vias in holes. As you know, touching these parts up is not feasable as the solder still keeps draining down the holes and chip cracking occurs during the process. Chip devices just can't take to much thermal and shouldn't with good designs. Oh Seth, before I forget, I forgot how to get either myself or other folks into your ftp site. Some folks are asking me how and I need to know as well as I'm on a different computer now and lost the info. Thanks, Earl --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------