This sounds almost like the mesh that holds the
stencil in the frame is becoming weak and stretched
allowing for extensive movement of the stencil during
the printing operation. IMHO.
 
Barry.
-----Original Message-----
From: Edward S. Wheeler [mailto:[log in to unmask]]
Sent: Friday, March 29, 2002 9:48 AM
To: [log in to unmask]
Subject: Re: [TN] solder paste registration

We have only seen stretch on our stencils cause a problem when they are old and very used. At this point it is best to purchase a new stencil, as it will pay for itself with reduced defects almost immediately. It may be worth while to see how the board is fixtured, as it can sometimes shift during the print cycle from time to time and cause problems.

Hope some of this is useful.

Ed




At 10:48 AM 3/29/2002 -0800, you wrote:
Ladies and Gentlemen,
 
We are having a major problem with an assembly house with registering
the solder paste to surface mount features prior to pick and place. They
are claiming that the boards are growing/shrinking some 15-20 mils.
We have done extensive measuring on unpopulated boards in-house
and cannot see more than 3-5 mils misregistration. The panel size
is approximately 14.00 x 16.00 inches, 20-24 mil pitch, and 15 BGA's
throughout the panel. Overall thickness .080. Is it possible that the mesh
screen that they are using can expand/contract over time? has anyone
heard of this experienced this situation before. Any information would be
greatly appreciated.
 
Thanks
Tony Steinke
AIT-Atlanta

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