Hi Siggi! A number of folks are using the JSTD-002A Component Solderability specification - test method S "Surface Mount Process Simulation" test. The test methodology is to stencil a solderpaste footprint pattern onto a nonwettable surface, place the BGA onto the footprint pattern, reflow, clean and inspect. The BGA eutectic solderspheres and the solderpaste should melt together to form coherent spheres - if you have a solderability problem (e.g. contamination, oxidation) you would see wetting problems. Good Luck. Dave Hillman JSTD002A Chairman [log in to unmask] "Zweigart, Siegmund" <[log in to unmask]>@ipc.org> on 03/14/2002 03:03:07 AM Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond to "Zweigart, Siegmund" <[log in to unmask]> Sent by: TechNet <[log in to unmask]> To: [log in to unmask] cc: Subject: [TN] Solderability of BGA Hello I am looking for some documents about solderability tests for BGA s with eutectik balls. Can anybody help me in this subject? We think that the BGA- Balls were touched by fingers and the solderiability is significant reduced. How can we analyse the component for fingerprints? We are thinking of looking for NaCl. Has anybody another idea? Siggi --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 --------------------------------------------------------------------------------- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------