Steve,
We
have made audits before and after the wave soldering,
and we
have found that really the components are being lost in the wave
soldering.
We
lost some components in prior the wave but they are very
few.
Alejandro
Hi
Alejandro!
Are you SURE the components are being lost in the wave? Are
you SURE they were there just prior to putting the assembly in the conveyer into
the wave?
From past experience, that was an assumption that was made
because the components were there after curing in the oven at surface mount, and
then missing after they came out of wave solder. Truth of the matter was that
they were knocked off during the handling during PTH stuffing, pre-wave masking,
prior to actually waving the assembly...there usually isn't any sort of
inspection step to ensure all the bottomside SMT components are there in between
bottomside SMT inspection until after wave solder. So it is sometimes missed
that the components were knocked off from all the handling that gets done prior
to wave.
Problem is, when most production people hear the word "epoxy"
(as in epoxied SMT components on the bottomside of a board), they equate that to
the two-ton stuff that you would use to repair a chair leg with...not
understanding that the epoxy that is used for SMT components has very little
strength, and don't handle the assemblies with the care that they
should...
My two-cents (with a coupon)..hehehe
-Steve
Gregory-
We are having issues with 0603 components attached with glue (Glue
printed with Pump printing)
that are being fallen in
the wave soldering equipment.
The average dot size that
we are having in these components is 0.025" and the average torque value is 1
N-cm.
What could be possible causes for this issue?
Regards,
Alejandro Becerra
Thomson multimedia
Inc