Steve, I know what you mean about no clean and the bottom side stencil aperture cleaner on the 286 and 288 and how they used to work well with alcohol and rma solder paste flux types. I tried DI and plain water as a substitue with no clean some time back. With the bottom side vacuum running, it kinda worked but must have been time dependent. Never ran an experiment but haven't done process engineering type stuff on stencil printers in a while either. I do miss that. Beyond that, most folks I know just gave up on the cleaning system. Earl --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------