Doug, I really have a pretty good handle on wave soldering, and most other types, as well as the ENIG process and its effects as quality, or not. What I'm asking here is if anyone knows what, in the fab process, might contribute to non wetting as previously described. I'm looking for some process step, after solder mask strip leaving bare copper over which ENIG was applied and after. The after must hold some kind of answer as the gold looks as it should though no cleanliness/contamination tests have been conducted, nor will they likely be as time is too short. I said that? I'll try to get the pics up today and, with good luck, I should have the reflow side images as well. I hope this answers Daan's questions as well because I couldn't really describe the events and effects without the photos. Steve has spoiled us all with his site and great service. Earl Moon --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------