"Reliability Of Ball Grid Array Packages In An Automotive Environment" Per-Erik Tegehall, Proc. Surface Mount International, 1997, pp. 85-92 analyzed ball cracking in BGA packages with dye penetrant methods.
Dave Fish
----- Original Message -----From: [log in to unmask]>Francis SunSent: Thursday, February 07, 2002 11:25 AMSubject: [TN] Source for color dye to test BGA solder jointsHello,Anyone out there know when I can get hold of color dye used to test for BGA connectivity?Any help would be appreciated.TIA--------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------
Francis Sun
MARK IV Industries
(905) 624-3025 ext. 1235
Fax: (905) 624-4572