Pete,

Do you have analysis that shows the separation you are experiencing is an adhesion of the electroless nickel to the electoplated copper? I'm assuming you are seeing some separation of a part soldered to a ENIG board (Cu/ENi/IAu). If you are seeing a "clean - flat" separation I'd look to see if it is a brittle fracture beween an IMC and the ENi.

Regards,
George

George M. Wenger (908)-546-4531 [log in to unmask]
Distinguished Member Technical Staff
Celiant Corporation, FMA Lab, 40 Technology Drive, NJ 07059

-----Original Message-----
From: Peter Nemcik [mailto:[log in to unmask]]
Sent: Thursday, February 28, 2002 8:21 AM
To: [log in to unmask]
Subject: [TN] Electroless nickel to electroplated copper separation

Can somebody shed some light on possible causes of adhesion problems between electroless nickel and electroplated copper, that occur at random intervals? Analysis of both baths show they are in order, and the nickel plating is not permitted to dry or passivate before going into the copper.

Thanks in advance

Pete

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