Hi Richard, You may have already noticed, but the new IPC-9701 that Jack Crawford announced last Friday sounds like it's just what you're looking for. Best regards, Daan Terstegge SMT Centre Thales Communications Unclassified mail Personal Website: http://www.smtinfo.net > -----Original Message----- > From: TechNet [mailto:[log in to unmask]]On Behalf Of Richard van Beveren > Sent: Sunday, February 03, 2002 9:52 PM > To: [log in to unmask] > Subject: [TN] Proving the reliability of a solder joint > > > Can anyone help with official standards that can be used to establish the > reliability of a given solder joint / assembly method? (other than visual > assessment) > > I am considering an assembly method that involves bending of auto-inserted > wire links after soldering. I am aware that this is not a > preferred method > but would like to know of any recognised tests that I can perform to test > the reliability of the solder joint "in service." Experience (and "home > made" vibration testing of the final product) to date has shown > little or no > reduction in solder joint reliability but I am keen to be able to > say, "yes, > I have tested this assembly/joint in accordance with IEC/DIN/MIL XXX" > > Thanks in advance, > > Richard van Beveren > Production Engineer > NEWTRONICS PTY LTD > > ------------------------------------------------------------------ > --------------- > Technet Mail List provided as a free service by IPC using LISTSERV 1.8d > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search previous postings at: www.ipc.org > On-Line Resources & > Databases > E-mail Archives > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for > additional > information, or contact Keach Sasamori at [log in to unmask] or > 847-509-9700 ext.5315 > ------------------------------------------------------------------ > --------------- > --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 --------------------------------------------------------------------------------- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------