Antonio None when it comes to reliability or production. When AgPd plated terminations are used the 2 percent silver slow down the dissolution of the metallisation during the soldering process. Best regards Guenter EMPA Swiss Federal Institute for Materials Testing and Research Centre for Reliability Dipl. Eng. Guenter Grossmann 8600 Duebendorf Switzerland Phone: xx41 1 823 4279 Fax : xx41 1823 4054 mail: [log in to unmask] --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------