Hi all,
We are currently using adhesive to glue chips on PCB and
then run the board on reflow oven followed by wave soldering. After
the reflow process we need to rework some chips occasionally due to
chip miss-alignment or missing. To do the rework we have to
remove the original glue, re-glue the chips and let the board go through the
reflow process again. Now we want to eliminate this loop by using hi-temp solder
wire (melting point 268-302 degree C) to solder the reworked chips without
adhesive, then let the reworked board directly go to wave soldering with
solder pot temperature around 245 degree C.
Has anyone using this method seen problems?
Eric