Just wondering, why there's 3-different packages for this part? Does the heat slug REALLY make a difference? Looks like there's one package that will fit the footprint that doesn't have the heat slug...the other package is a 1.27mm pitch part. One other question that I'll throw-out there, is why in the hell do companies like Texas Instruments put components on the market that can't be assembled with standard processes? This kinda stuff really sucks! -Steve Gregory- > Oh uh, yes, me out of cave. Very bright out here. Smells better too. > > Werner, now we're getting somewhere. You are my consultant and I owe you > big > time. Check coming by big bird with no feathers. > > I still need to know if the die attach is via soldering process and bumps > on > flip side while using underfill - and lots of it too. Must be that. > > This sure doesn't look good to me as a simple knife wielding FA guy. Now I > have to get that damn chip of that little board without loosing a finger. > Also need a dremmel to do x-section. Hell, I could send it to Robisan. > Susan, you ready for this and how about my photomicrographs? > > MoonCaveMan > >