Hi MoonCaveMan, I had thought YOU had come out of your cave. I am currently babysitting for my 3 granddaughters in NC. Steve says: it is a 384-ball .8mm pitch PBGA with a heatslug on the top... If it is in fact a PBGA with a heatslug on the top, than it is a SBGA--these are notorious for warping when you change their temperature because they are of a thermally asymetric design. I have seen solder balls ripped of the pads and soldering pads ripped out of the PCB. You could also be right about the silicone affecting the global expansion mismatch with the PCB. TI has just agreed to license their microStarBGAs under Tessera's patents to avoid infringement [Sharp's CSPs were found to infringe Tessera's patents]. But it is not just CSPs that might have their BLR affected by the die; larger BGAs that are thin can suffer from the same problem. Werner Engelmaier --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------