Hello, I ran into an application requiring SMT reflow soldering of a small copper clip to a pad. The resulting solder joint was so weak that a slight pull on the overhanging lip will rip off the entire clip from the pad. I examined the mating surfaces afterwards and both were still solderable. The 0.005" thick clip has a flat 1/4"x1/4" surface which was placed right on top of the pad with the same size. Stencil aperture is 1:1 and both the pad and clip have good solderability (before and after). The rest of the components on the boards are soldered well. I like to know if there is a way to determine how much pull strength should I expect with such design? In order to strengthen the solder joint, does it make sense to increase the size of the pad to ensure wetting on the edge and force excess solder to flow on top of the clip? Any advice is appreciated. Rgds, Peter _________________________________________________________ Do You Yahoo!? Get your free @yahoo.com address at http://mail.yahoo.com --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------