IMHO: not much help with agressive OA fluxes. opens process windows a bit with no-cleans. may be important for Lead-Free processing. > -----Original Message----- > From: TechNet [mailto:[log in to unmask]]On Behalf Of Grant Emandien > Sent: Wednesday, February 06, 2002 10:38 AM > To: [log in to unmask] > Subject: [TN] Nitrogen atmosphere reflow soldering: Costs & Benefits > > > 'netters, > > I am presently exploring the cost-benefits of nitrogen atmosphere > soldering > in our facility. Opinions and recommendations in literature > obtained thusfar > has been broad and varied. Some bemoan costs while others hail defects > reduction. We presently have a nitrogen atmosphere wave soldering facility > and yes, dross reduction leading to better looking joints. > > But what have your experiences been and the benefits gained by using > nitrogen for (a) no-clean and (b) water-soluble solder? > > What are the limitations and any disadvantages of using nitrogen? > > TIA > Grant > > > ********************************************************************** > Notice: > > The information contained in this e-mail (including any > attachments) may contain commercially sensitive or confidential > information which may be legally privileged and is for the sole > use of the intended recipient(s). If you are not, or believe you > may not be, the intended recipient, you are hereby notified that > any use, dissemination, copying, review, disclosure or action > taken in reliance of this e-mail is prohibited and may be > unlawful. If you have received this message in error, please > notify the sender immediately by reply e-mail and delete all > copies of the message. > > Any views expressed in this message are those of the individual > sender unless expressly stated by the sender to be given on > behalf of Tellumat (Pty) Ltd. Tellumat (Pty) Ltd disclaims > liability for any unauthorised opinion or representation made by > the sender on behalf of Tellumat (Pty) Ltd. > > No warranty is given by Tellumat (Pty) Ltd that the integrity or > security of this e-mail (including any attachments) has been > maintained through transmission, nor that the communication is > free of virus, interception or interference. > > ********************************************************************** > > ------------------------------------------------------------------ > --------------- > Technet Mail List provided as a free service by IPC using LISTSERV 1.8d > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search previous postings at: www.ipc.org > On-Line Resources & > Databases > E-mail Archives > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for > additional > information, or contact Keach Sasamori at [log in to unmask] or > 847-509-9700 ext.5315 > ------------------------------------------------------------------ > --------------- > --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------