I'm looking for information on intermetallic growth, for a good solder
joint, what is acceptable and what is unacceptable as being too low or too
high.

As far as I know, it depends on the elements and thermal cycles.
Assume: Cu-Sn63Pb37 and  NiAu-Sn63Pb37,
90 seconds in liquidus, 2 thermal cycles.

How does the intermetallic thickness change if I had to change the paste
from eutectic to Ag2-Sn-Pb? (not even to mention lead-free paste)

Is there any formula that can help in undestanding what would be the
intermetallic thickness if I had to undergo another thermal cycle, or if I
had to change the liquidus time on my oven profile?

Any information will be very welcome.
Thanks,
Ivanoe

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