I'm looking for information on intermetallic growth, for a good solder joint, what is acceptable and what is unacceptable as being too low or too high. As far as I know, it depends on the elements and thermal cycles. Assume: Cu-Sn63Pb37 and NiAu-Sn63Pb37, 90 seconds in liquidus, 2 thermal cycles. How does the intermetallic thickness change if I had to change the paste from eutectic to Ag2-Sn-Pb? (not even to mention lead-free paste) Is there any formula that can help in undestanding what would be the intermetallic thickness if I had to undergo another thermal cycle, or if I had to change the liquidus time on my oven profile? Any information will be very welcome. Thanks, Ivanoe --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------