Roger, In a word; yes. Your concerns are justified. Here's a good *.PDF file that addresses the assembly of Flipfet devices, it's at: http://www.eetasia.com/ART_8800066987_499505,499512.HTM Soldermask defined pads are less reliable than non-soldermask defined pads, and using ENIG finish, gold embrittlement could be a concern with solder joints that small... -Steve Gregory- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------