Roger,

In a word; yes. Your concerns are justified. Here's a good *.PDF file that
addresses the assembly of Flipfet devices, it's at:

http://www.eetasia.com/ART_8800066987_499505,499512.HTM

Soldermask defined pads are less reliable than non-soldermask defined pads,
and using ENIG finish, gold embrittlement could be a concern with solder
joints that small...

-Steve Gregory-

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