I'm with you Werner on this one. Still haven't figured out how the balls fell of the initial run of TI parts and stuck to the PCB. Hell, I just found out these parts only appear ceramic. They may not be though aluminum tops may be made to appear such. Worse may be the flip chip design on ceramic with some interposer, maybe, with a CTE of 3. I'm not getting much help from the supplier. I am getting help from users with information both good and bad The good info says it is very likely good solder joints may be effected under very well managed design, fabrication, and stencil concitions. The bad is other people like my company experiencing nothing but bad as initially poor quality notwithstanding poor long term, whatever that is, reliability. What the hell brings you out of your cave? MoonCaveMan --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------