Steve, My thanks as always. Just some notes about the pics: 1) The gull wing lead clearly shows indications of over heating during reflow as the solder wicked way up the lead. Lot's of focused IR crap in those days. 2) The J lead solder joint (solder really never wetted to the lead but did to the board) cracked because of excessively oxidized leads. About all this customer's product was wiped out because the component supplier, a big one at that, screwed up. 3) The two chip device voidings were found after soldering them to a ceramic substrate and then simply pulled off it. We were talking about these substrates before and I forgot to mention Coors and Kyocera both provide two inch, or so, square samples. I always carry about half a dozen of them around until the break - then I get new ones. Enjoy, Earl --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------